# Semtech Brings 5G Network Slicing, FIPS 140-3 to IACP 2026

- Source: Business Wire
- Published: 2026-10-24T12:00:00+00:00
- Category: Business
- Original: http://www.businesswire.com/news/home/20261024697343/en/Semtech-Brings-5G-Network-Slicing-FIPS-140-3-to-IACP-2026/?feedref=JjAwJuNHiystnCoBq_hl-WsGkFyUNMTSNrPsg57HLEqqcp-o_pnudlUwsb5apQ1S4gUE65BTfjH3-pSuqdv0gW3cb3F4oTIgUqCPafFkgu5AneicJQDNboWvodvG82E0
- Canonical: https://groundlevelnews.com/story/semtech-brings-5g-network-slicing-fips-140-3-to-iacp-2026-d01d84/

CAMARILLO, Calif.--(BUSINESS WIRE)--Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things (“IoT”) devices worldwide, is adding new resilient communications building blocks to its AirLink® 5G Networking Solutions. Semtech will demonstrate the new capabilities in booth #2964 at the In

_Ground Level News shows a short summary only; the full article and all rights belong to Business Wire._