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Thursday, October 22, 2026Updated 06:04 UTC

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Verda y Compal amplían su colaboración en infraestructura global de IA en GTC Berlín 2026

Source: PR Newswire · Oct 22, 2026 02:17 UTC

Close-up of a silicon wafer with rainbow reflections from its etched chips — File photo naotakem / Flickr · CC BY 2.0 · Source

The Quick Take

La creciente capacidad de fabricación de Compal y su infraestructura basada en NVIDIA HGX B300 respaldan la expansión de la implementación de la nube de IA de Verda en los mercados globales BERLIN, 22 de octubre de 2026 /PRNewswire/ -- Verda y Compal Electronics (Compal; TWSE: 2324) están...

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